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IBM and Alliance Partners Consider Adopting 15nm or Less
Alliance of semiconductor manufacturers, led by IBM, unveils information on its plans to master new technological processes. According to these plans, companies are considering 32nm process technology as an alternative to 40nm process technology, and will use 28nm transient process technology when mastering finer standards.
At the same time, IBM and its partners are exploring the possibility of producing microcircuits at 15 nm or less. Unconventional technologies are being considered, including carbon nanotubes, FinFET, “thin” silicon on an insulator, etc.P., a source claims with reference to the head of the IBM Semiconductor Research and Development Center.
IBM and its manufacturing partners – Chartered Semiconductor Manufacturing and Samsung Electronics – are currently producing 65nm products. Soon, all three companies intend to start shipping 45nm products. At the same time, Chartered, as you know, plans to develop an intermediate 40-nm 40G process technology, while IBM and Samsung did not express such intentions. The technology for the production of 40-nm microcircuits is also being developed by TSMC and UMC.
However, some experts believe that the economic downturn and other factors may reduce the need for 40nm technology. This is one of the reasons why IBM expects to go straight to the 32nm process technology, bypassing 40nm.
Several IBM developments will find application in new technological processes, including high-k dielectrics, metal gates, and the previously announced air-gap technology. Recall that the essence of this technology is the formation of microscopic hollow structures that play the role of insulators inside the crystal, using the self-assembly mechanism.
By the end of next year, IBM and its partners expect to have two versions of the 32nm process technology. One of them will be designed for the production of products optimized for the criterion of energy consumption, and the second for general-purpose microcircuits. Six months after mastering 32nm technology, 28nm will be ready, IBM spokesman said. A 22nm process technology is already under development, which is likely to be the last one used to form flat structures.
Source: EE Times