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450mm plates: TSMC is already moving, Rohm & Haas approves, and Chartered has no plans
As you know, in May this year, Intel Corporation, Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) reached an agreement on the need for industry-wide cooperation in order to switch to the use of 18-inch (450-mm) wafers in the production of semiconductor chips. The largest substrates in use today are 12 inches (300 mm) in diameter. Industry response to plans to move to larger insert diameters has been mixed.
According to the source, the company (TSMC) positively evaluates the transition process and is already carrying out related work. The main point of application of efforts at this stage is the assessment of the so-called economies of scale – the effect of reducing average costs as the volume of output increases. Achieving this effect requires a concerted effort from OEMs, chip manufacturers and their customers. Evaluating the industry experience of moving from four-inch to six-inch, then eight, and finally 12-inch plates, the TSMC chief noted that each such transition produced the mentioned effect, but the transition from 12 to 18 inches is not as obvious as the previous ones. At the same time, TSMC sees no insurmountable obstacles to such a transition and treats it positively.
A similar assessment is shared by Rohm & Haas, the largest supplier of materials for semiconductor manufacturing. President of one of the Rohm & Haas divisions, answering questions about the company’s strategy and the industry’s transition to 450mm plates, said the company is ready for such a transition. This is facilitated by Rohm & Haas’ close ties with major market players. Rohm & Haas plans to release all materials needed to produce 450mm plates. It is important to understand that not all manufacturers are capable of producing products that meet the requirements associated with the transition. This pushes companies, which usually perceived each other as rivals, to cooperate, which will allow sharing the costs of research and development, especially significant in this case.
But Chartered Semiconductor Manufacturing has no plans to switch to larger diameter wafers. The head of Chartered said that it is too early to discuss this topic, as there is no equipment that can be evaluated in working with 450 mm plates. Commenting on the agreement between Intel, Samsung and TSMC Therefore, he referred to the lack of information, which does not allow assessing the feasibility of switching to 450 mm plates. Currently, Chartered continues construction of a new 300mm Fab 8 factory, already producing products. Now there are processed monthly 22-23 thousand. plates. The company expects to bring this figure to the planned mark of 45 thousand next year.