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Intel, Samsung and TSMC reach agreement to switch to 450mm substrates

Intel, Samsung Electronics, and TSMC announced agreement was reached on the need for industry-wide collaboration to migrate to large, 450mm substrates starting in 2021. The companies intend to work together with representatives of the semiconductor industry in order to ensure that the necessary components, infrastructure and production facilities are developed and tested by the deadline for the implementation of the pilot line.

Manufacturing microcircuits using larger diameter substrates allows increasing the output of semiconductors with minimal costs. The total surface area of ​​a 450 mm substrate and the number of printed IC chips (for example, individual computer chips) is more than 2 times higher than the corresponding figures for 350 mm substrates. Larger diameter substrates reduce the cost of manufacturing a single microcircuit. In addition, by making more efficient use of energy, substrate area, and other resources, larger substrates will help reduce the overall resource usage required to fabricate a single chip.

Intel, Samsung and TSMC note that the semiconductor industry can improve its ROI and significantly reduce research and development costs for 450mm wafer technology through consistent standards, streamlining infrastructure changes, and automating 300mm wafer manufacturing, and general work schedule. Companies also believe that a collaborative approach will help minimize the risk and cost associated with technology transitions.

Previously, migration to larger substrates traditionally began every 10 years since the last transition. For example, the industry transition to 300mm wafers in 2021 comes a decade after the first 200mm wafer manufacturing facility went online in 1991.

In keeping with the industry’s historical pace, Intel, Samsung and TSMC see 2021 as the right time to start moving to 450mm substrates. Given the complexity of integrating all the components to migrate to a given substrate size, companies believe that a consistent assessment of the target schedule is critical to achieving industry-wide readiness.

Intel, Samsung and TSMC will continue to work with the Sematech International Consortium (ISMI) as this organization plays a critical role in coordinating the industry’s efforts to supply 450mm substrates, define standards, and develop test benches for equipment.

Let us remind you that AMD considers it inexpedient to switch to 450-mm plates – in its opinion, the potential of 300-mm plates has not yet been fully revealed. But the head of VLSI Research believes that “450 mm will come”, however, he considers 2021 as a more realistic date for the appearance of the first factories for such plates. It seems that the combined efforts of Intel, Samsung Electronics and TSMC will still be able to realize their plans, contrary to the opinion of skeptics.

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