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Apr 22, · Download Apple iTunes for Windows – iTunes is a free application for Windows and macOS. Play all your music, video and sync content to your iPhone, iPad, and Apple TV/5. Jun 06, · Points System. When you upload software to you get rewarded by points. For every field that is filled out correctly, points will be rewarded, some fields are optional but the more you provide the more you will get rewarded! Apr 27, · Find more information about iTunes for Windows in the iTunes user guide. Learn how to use Restrictions to block or limit access to explicit content in the iTunes Store. If you download iTunes from the Microsoft Store, iTunes will automatically update when a new version is available. Learn more about updating ted Reading Time: 2 mins.
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IBM specialists create a prototype of a chip with integrated water cooling
Employees of the IBM research laboratory, together with specialists from the Berlin Fraunhofer Institute, demonstrated a prototype with a cooling system integrated into the three-dimensional structure of the microcircuit. In other words, the water in the prototype passes directly between the chips assembled into a stack.
Such chip assemblies are a promising way to increase the degree of integration, replacing the more traditional arrangement of crystals in one plane. Recall that the company announced a corresponding breakthrough in the technology for the production of semiconductor microcircuits in April last year.
With an increase in the degree of integration, the problem of heat dissipation arises – according to IBM, new microcircuits can generate up to 1 kW, which is an order of magnitude greater than the ability to dissipate heat through the case cover, which usually has an area of several square centimeters. In addition, each semiconductor layer inside the stack represents an obstacle to heat dissipation from other layers.
The solution was found in the integration of the channels of the water cooling system directly into the stack, as shown in the first illustration. The prototype shown in the second illustration, which used a structure of two semiconductor layers with numerous channels between them, confirmed the workability of the idea. In this case, the thickness of the “pipes” was equal to 50 microns, and the efficiency of heat dissipation of each layer in a stack with an area of 4 sq.cm was 180 W / sq.cm.
According to scientists, it takes at least five years to bring the technology to commercial application.